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HPT-TCX2000Thermal Insulator Sheet

HPT-TCX2000It is a thermal insulation sheet product made of glass fiber reinforced silicone rubber, which has both thermal conductivity and high pressure insulation performance. Mainly used between heating semiconductor devices and heat dissipation substrates, it plays a role in thermal conductivity and insulation. The surface is flat and smooth, with good adhesion performance on various metal and ceramic devices. High thermal conductivity enables it to achieve low interface thermal resistance performance at relatively low pressures, achieving efficient heat dissipation of heating components.

Product Introduction

Product Parameters

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Product Features

Excellent thermal conductivity, low thermal resistance, and stable performance, reliable for long-term use; Bridge the process gap in structure and reduce the process gap requirements for radiators and heat dissipation structural components; Has certain flexibility and excellent insulation properties; The surface is flat and smooth, without any stickiness, and has good adhesion performance on various metal and ceramic devices; Reusable convenience.

Typical Applications

Between the aluminum substrate and the heat sink; Thermal conductivity between MOS tubes, transformers (or capacitors/PFC inductors) and heat sinks or enclosures; Thermal conduction and heat dissipation between the motherboard IC and the heat sink or casing; Application in the automotive electronics industry (such as xenon lamp ballasts, speakers, car series products, etc.); Between the amplifier IC, image decoder IC, and heat sink (casing); Microwave oven/air conditioner (between fan motor power IC and housing)/induction cooker (between thermistor and heat sink).

Product Parameters

Product FeaturesUnitParameterTest Standard
Enhanced Substrate——FiberglassN/A
Color——WhiteVision
Specific Gravityg/cm32.5±0.1ASTM D792
Thicknessmm0.25、0.35、0.5ASTM D374
HardnessShore  A80±10ASTM D 2240
Tensile StrengthMPa≧5ASTM D412
Flame Retardant Rating——V-0UL94
Operating Temperature—60~180N/A
Thermal ConductivityW/m·K2.0 ASTM D5470
Thermal Resistance@0.23mm,
50psi
℃in2/W0.45ASTM D5470
Breakdown Voltage@0.23mmkV/mm≧5ASTM D149
Volume ResistivityΩ·cm≧1013ASTM D257
Dielectric Constant@1MHz≧4ASTM D150
Dielectric Loss@1MHz≦0.1ASTM D150
Shelf LifeMonth12——

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