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2-HPD-TC200D Low Volatile Thermal Conductive Silicone Film

It is a low-density, low siloxane content polymer material silicone gasket, suitable for the electronic/electrical field with heat dissipation requirements. It is specifically designed to use gaps to transfer heat, fill gaps, and complete heat transfer between heating and cooling parts. At the same time, it also plays a role in insulation, shock absorption, sealing, etc. It can meet the design requirements of equipment miniaturization and ultra-thin design, with high processability and usability, and a wide range of thickness applications. It is an excellent thermal conductive filling material. It has certain flexibility, excellent insulation, compressibility, and natural surface viscosity, which can meet the requirements of automated production and convenient product maintenance.

Product Introduction

Product Parameters

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Product Features

Excellent thermal conductivity, low thermal resistance, low volatile matter, with a siloxane content of D3-D20 ≤ 200ppm and stable performance, reliable for long-term use; Bridge the process gap in structure and reduce the process gap requirements for radiators and heat dissipation structural components; Has certain flexibility, excellent insulation, and protection against EMC; The material is soft, has good compressibility, and has shock-absorbing and sound-absorbing effects; Good resilience and convenient installation and testing for repeated use; The surface has a certain adhesive force, which can effectively adhere to IC or metal surfaces and is not easy to peel off.

Typical Applications

Between the aluminum substrate and the heat sink; Thermal conductivity between MOS tubes, transformers (or capacitors/PFC inductors) and heat sinks or enclosures; Thermal conduction and heat dissipation between the motherboard IC and the heat sink or casing; Application in the automotive electronics industry (such as xenon lamp ballasts, speakers, car series products, etc.); Between the amplifier IC, image decoder IC, and heat sink (casing); Microwave oven/air conditioner (between fan motor power IC and housing)/induction cooker (between thermistor and heat sink).

Product Parameters

Product FeaturesUnitParameterTest Standard
Structure——Ceramic Filled SiliconN/A
Color——GreyVision
Specific Gravityg/cm32.2±0.2ASTMD792
Thicknessmm0.3-10.0ASTMD374
HardnessShore C20-55ASTMD2240
Tensile Strength@1mmMPa≧0.15ASTMD412
Elongation at break@1mm%≥50ASTMD412
Compression Ratio@ShoreC
25,50psi
%≧25ASTMD575
Oil Yield Rate%≦3150℃48h
Siloxanes Content(D3-D20)ppm≦200EPA8270E:2018
Flame Retardant Rating——V-0UL94
Operating Temperature-40~200ASTMD5470
Thermal Conductivity@3mm,20psiW/m·K2.0±0.2ASTMD5470
Thermal Resistance@1mm,20psi℃in2/W0.65ASTMD149
Breakdown VoltagekV/mm≧6.5ASTMD257
Volume ResistivityΩ·cm≧101 3ASTMD150
Dielectric Constant@1MHz≧4ASTMD150
Dielectric Loss@1MHz≦0.1ASTMD150
Shelf Lifemonth12——

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