The frequency of smartphone chips is getting higher and higher, which generates a large amount of heat. Excessive heat can affect user comfort and may also burn out hardware. Therefore, major manufacturers will consider how to dissipate heat from smartphones.
The main heat source of smartphones
1. Main circuit board CPU、 Memory module, GPS module, RF circuit, screen display circuit WIFI、 Bluetooth module and other heat sources.
2. Heat sources such as secondary circuit board, antenna module, light sensing module, front camera module, etc.
3. Electrical Board
Measurement and Analysis of Surface Temperature on Smartphones
Phone equipped with Snapdragon 810 chip has a full load test surface temperature of 55.4 ℃
39.4℃ | 55.4℃ | 38.7℃ | 44.2℃ | 37.8℃
Application of Thermal Conductive Silicone Gasket in the Smartphone Industry
The application of graphite sheets in the smartphone industry
Application description: Attaching a thermal conductive silicone sheet to the main chip heating position helps to quickly transfer the heat of the chip to the shielding cover, and dissipate the heat through the graphite sheet attached to the surface of the shielding cover
Schematic diagram of thermal conductivity and heat dissipation effect of graphite sheet
