It is a paste like gap filling thermal conductive material suitable for electronic/electrical systems with heat dissipation requirements
In the field of gas, it is particularly suitable for situations where different components share a heat sink, which is the combination of a heat sink and a substrate
The optimal selection scheme for thermal interface materials with variable shapes and uneven surfaces, which can automatically dispense glue and achieve automation
Transform homework. Meet the requirements of low stress and high compression modulus during use. No settlement, no flow, weather resistance
Good. After curing, it is easy to peel off, does not contaminate the components, and is convenient for later repair.