Product Features
Excellent thermal conductivity, low thermal resistance, and stable performance, reliable for long-term use; Bridge the process gap in structure and reduce the process gap requirements for radiators and heat dissipation structural components; Has certain flexibility and excellent insulation properties; The surface is flat and smooth, without any stickiness, and has good adhesion performance on various metal and ceramic devices; Reusable convenience.
Typical Applications
Between the aluminum substrate and the heat sink; Thermal conductivity between MOS tubes, transformers (or capacitors/PFC inductors) and heat sinks or enclosures; Thermal conduction and heat dissipation between the motherboard IC and the heat sink or casing; Application in the automotive electronics industry (such as xenon lamp ballasts, speakers, car series products, etc.); Between the amplifier IC, image decoder IC, and heat sink (casing); Microwave oven/air conditioner (between fan motor power IC and housing)/induction cooker (between thermistor and heat sink).