CN

HPD-TC150XB Thermal Absorbing Pad

It is a polymer material silicone gasket that combines heat dissipation and electromagnetic wave countermeasures. It is suitable for the electronic field with heat dissipation and absorption needs. It is specifically designed to use gaps to transfer heat and absorb electromagnetic radiation. It can fill gaps, complete heat transfer between heating and cooling parts, and also serve insulation, shock absorption, sealing, and electromagnetic interference elimination functions. It can meet the design requirements of equipment miniaturization and ultra-thin design, has high processability and usability, and has a wide range of thickness applications. It is an excellent thermal conductivity and absorption filling material. It has certain flexibility, excellent insulation, compressibility, and natural surface viscosity, which can meet the requirements of automated production and convenient product maintenance, providing a good solution for thermal conductivity and electromagnetic shielding of electronic communication products.

Product Introduction

Product Parameters

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Product Features

It is a polymer material silicone gasket that combines heat dissipation and electromagnetic wave countermeasures. It is suitable for the electronic field with heat dissipation and absorption needs. It is specifically designed to use gaps to transfer heat and absorb electromagnetic radiation. It can fill gaps, complete heat transfer between heating and cooling parts, and also serve insulation, shock absorption, sealing, and electromagnetic interference elimination functions. It can meet the design requirements of equipment miniaturization and ultra-thin design, has high processability and usability, and has a wide range of thickness applications. It is an excellent thermal conductivity and absorption filling material. It has certain flexibility, excellent insulation, compressibility, and natural surface viscosity, which can meet the requirements of automated production and convenient product maintenance, providing a good solution for thermal conductivity and electromagnetic shielding of electronic communication products.

Typical Applications

5G communication base station; Thermal conduction and heat dissipation between the motherboard IC and the heat sink or casing; Between the amplifier IC, image decoder IC, and heat sink (casing); Microwave oven/air conditioner (between fan motor power IC and housing).

Product Parameters

Product FeaturesUnitParameterTest Standard
Frequency Of UseGHz2-6@2mm
3-12@1mm
GJB2038A-2011
Color——Grayish BlackVision
Specific Gravityg/cm34.1±0.2ASTM D792
Thicknessmm0.5-3.0ASTM D374
HardnessShore C20-55ASTM D 2240
Tensile Strength@SC30,1mmMPa≧0.15ASTM D412
Tear Strength @SC30,1mmN/mm≥0.5ASTM D412
Elongation at break@SC30,1mm%≥150ASTM D412
Compression Ratio@SC25,50psi%≧30ASTM D 575
Oil Yield Rate%≦3150℃48h
Flame Retardant Rating——V-0UL94
Operating Temperature-40~200N/A
Thermal Conductivity@3mm,20psiW/m·K1.5±0.2ASTMD5470
Thermal Resistance@1mm,20psi℃in2/W≦0.70ASTMD5470
Breakdown Voltage@1mmkV/mm≧1ASTMD149
Volume Resistivity@1mmΩ·cm≧1012ASTMD257
Dielectric Constant@2mm,1MHzC²/(N·m²)≧2ASTMD150
Dielectric Loss@2mm,1MHzC²/(N·m²)≦0.1ASTMD150
Shelf LifeMonth12——


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