Product Features
·Excellent thermal conductivity, low thermal resistance, and stable performance, reliable for long-term use;
·Bridge the process gap in structure and reduce the process gap requirements for radiators and heat dissipation structural components;
·Has certain flexibility and excellent insulation properties;
·Single sided backing with one layer of non substrate double-sided tape, good adhesion, and good adhesion performance on various metal and ceramic device surfaces;
·Reusable convenience;
Typical Applications
·Between the aluminum substrate and the heat sink;
·Thermal conductivity between MOS tubes, transformers (or capacitors/PFC inductors) and heat sinks or enclosures;
·Thermal conduction and heat dissipation between the motherboard IC and the heat sink or casing;
·Application in the automotive electronics industry (such as xenon lamp ballasts, speakers, car series products, etc.);
·Between the amplifier IC, image decoder IC, and heat sink (casing);
·Microwave oven/air conditioner (between fan motor power IC and housing)/induction cooker (between thermistor and heat sink).