Product Features
Excellent thermal conductivity, low thermal resistance, and stable performance, reliable for long-term use;
Low density products effectively reduce product weight and have a wider range of applications;
Bridge the process gap in structure and reduce the process gap requirements for radiators and heat dissipation structural components;
Has certain flexibility, excellent insulation, and protection against EMC;
The material is soft, has good compressibility, and has shock-absorbing and sound-absorbing effects;
Good resilience and convenient installation and testing for repeated use;
The surface has a certain adhesive force, which can effectively adhere to IC or metal surfaces and is not easy to peel off.
Typical Applications
Between the aluminum substrate and the heat sink;
Thermal conductivity between MOS tubes, transformers (or capacitors/PFC inductors) and heat sinks or enclosures;
Thermal conduction and heat dissipation between the motherboard IC and the heat sink or casing;
Application in the automotive electronics industry (such as xenon lamp ballasts, speakers, car series products, etc.);
Between the amplifier IC, image decoder IC, and heat sink (casing);
Microwave oven/air conditioner (between fan motor power IC and housing)/induction cooker (between thermistor and heat sink).
Consult Now
Download Now
