2-HPD-TC150L Low oil thermal conductivity silicone film_Thermal Silicone Pads_Products

2-HPD-TC150L Low oil thermal conductivity silicone film

2-HPD-TC150L is a low-density, low oil polymer material silicone gasket suitable for the electronic/electrical field with heat dissipation requirements. It is specifically designed to use gaps to transfer heat, fill gaps, and complete heat transfer between heating and cooling parts. At the same time, it also plays a role in insulation, shock absorption, sealing, etc. It can meet the design requirements of equipment miniaturization and ultra-thin design, with high processability and usability, and a wide range of thickness applications. It is an excellent thermal conductive filling material. It has certain flexibility, excellent insulation, compressibility, and natural surface viscosity, which can meet the requirements of automated production and convenient product maintenance.

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Product Features

Excellent thermal conductivity, low thermal resistance, ultra-low volatile matter, and stable performance, reliable for long-term use; Bridge the process gap in structure and reduce the process gap requirements for radiators and heat dissipation structural components; Has certain flexibility, excellent insulation, and protection against EMC; The material is soft, has good compressibility, and has shock-absorbing and sound-absorbing effects; Good resilience and convenient installation and testing for repeated use; The surface has a certain adhesive force, which can effectively stick to the IC or the entire surface, and is not easy to peel off.

Typical Applications

Between the aluminum substrate and the heat sink; Thermal conductivity between MOS tubes, transformers (or capacitors/PFC inductors) and heat sinks or enclosures; Thermal conduction and heat dissipation between the motherboard IC and the heat sink or casing; Application in the automotive electronics industry (such as xenon lamp ballasts, speakers, car series products, etc.); Between the amplifier IC, image decoder IC, and heat sink (casing); Microwave oven/air conditioner (between fan motor power IC and housing)/induction cooker (between thermistor and heat sink).

Product Parameters

Product Features	Unit	parameter	Test Standard
Structure	——	Ceramic Filled Silicon	N/A
Color	——	Grey	Vision
Specific Gravity	g/cm³	1.9±0.2	ASTM D792
Thickness	mm	0.3-10.0	ASTM D374
Hardness	Shore C	20-55	ASTM D 2240
Tensile strength@SC30,1mm	MPa	≧0.15	ASTM D412
Tear strength @SC30,1mm	N/mm	≥0.5	ASTM D412
Elongation at break@SC30,1mm	%	≥150	ASTM D412
Compression ratio@SC25,50psi	%	≧25	ASTM D 575
Oil Yield Rate	%	≦0.8	150℃48h
Flame Retardant Rating	——	V-0	UL94
Operating Temperature	℃	-40~200	N/A
Thermal Properties ：
Thermal Conductivity@3mm,20psi	W/m·K	1.5±0.2	ASTM D5470
Thermal Resistance@1mm,20psi	℃in²/W	≦0.75	ASTM D5470
Electrical characteristics：
Breakdown Voltage@1mm	kV/mm	≧6.5	ASTM D149
Volume Resistivity@1mm	Ω·cm	≧10¹³	ASTM D257
Dielectric Constant@2mm,1MHz	C²/(N·m²)	≧3	ASTM D150
Dielectric loss@2mm,1MHz	——	≦0.1	ASTM D150
Shelf Life	Month	12	——