Product Features
Excellent thermal conductivity, low thermal resistance, and stable performance, reliable for long-term use;
Low density products effectively reduce product weight and have a wider range of applications;
Bridge the process gap in structure and reduce the process gap requirements for radiators and heat dissipation structural components;
Has certain flexibility, excellent insulation, and protection against EMC;
The material is soft, has good compressibility, and has shock-absorbing and sound-absorbing effects;
Good resilience and convenient installation and testing for repeated use;
Single sided adhesive backing, capable of backing 3M9448A, 3M467, etc., can effectively adhere to IC or metal surfaces without easy detachment.
Typical Applications
Between the aluminum substrate and the heat sink;
Thermal conductivity between MOS tubes, transformers (or capacitors/PFC inductors) and heat sinks or enclosures;
Thermal conduction and heat dissipation between the motherboard IC and the heat sink or casing;
Application in the automotive electronics industry (such as xenon lamp ballasts, speakers, car series products, etc.);
Between the amplifier IC, image decoder IC, and heat sink (casing);
Microwave oven/air conditioner (between fan motor power IC and housing)/induction cooker (between thermistor and heat sink).
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