HPD-TCG08 After curing, the thermal conductive sealant is a flexible elastic material, suitable for electronic/electrical fields with heat dissipation requirements, especially for situations where the entire heating component needs heat dissipation and sealing insulation. Its target is a relatively uniform heat generating whole, which plays a sealing role to prevent the whole from being affected by external factors and the mutual influence of components in the whole. Meet the requirements of low viscosity and good leveling when using sealant. Good impact resistance, strong adhesion, insulation, moisture resistance, earthquake resistance, corona resistance, electrical leakage resistance, and chemical medium resistance.