Product Features
Excellent thermal conductivity, low thermal resistance, and stable performance, reliable for long-term use;
Bridge the process gap in structure and reduce the process gap requirements for radiators and heat dissipation structural components;
Has certain flexibility and excellent insulation properties;
The surface is flat and smooth, without any stickiness, and has good adhesion performance on various metal and ceramic devices;
Reusable convenience;
Typical Applications
Between the aluminum substrate and the heat sink;
Thermal conductivity between MOS tubes, transformers (or capacitors/PFC inductors) and heat sinks or enclosures;
Thermal conduction and heat dissipation between the motherboard IC and the heat sink or casing;
Application in the automotive electronics industry (such as xenon lamp ballasts, speakers, car series products, etc.);
Between the amplifier IC, image decoder IC, and heat sink (casing);
Microwave oven/air conditioner (between fan motor power IC and housing)/induction cooker (between thermistor and heat sink).