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What is Thermal Interface Material (TIM)?

Time:2023-09-19Browse:87

Answer: Thermal interface material is a commonly used material for IC packaging and electronic heat dissipation, applied between a heat source and a heat sink. It is mainly used to fill the micro gaps and uneven holes on the surface caused by the bonding or contact of the two materials, eliminate the air between the heat source and the heat sink, reduce the heat transfer contact thermal resistance, and make the heat dispersion more uniform. This improves the heat dissipation performance and efficiency of the device, and reduces the contact thermal resistance between them.

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