HPD-TC820 It is a paste like gap filling thermal conductive material, suitable for electronic/electrical fields with heat dissipation requirements, especially for situations where different components share a heat sink. It is the best thermal interface material selection solution for the shape and unevenness between the heat sink and the substrate, and can automatically dispense glue to achieve automated operations. Meet the requirements of low stress and high compression modulus during use. No settlement, no flow, good weather resistance. Easy to peel off after curing, non polluting components, convenient for later repair。