HP-TC400NGOne Component Thermal Conductive Gel_Thermal Gels_Products

HP-TC400NGOne Component Thermal Conductive Gel

HP-TC400NGIt is a paste like gap filling thermal conductive material. Shaped according to the structural shape, it has the best structural applicability and surface adhesion characteristics for uneven ceramic heat sinks or irregular cavities. The gaps are fully filled, and it has good insulation and voltage resistance characteristics and thermal stability, making it safe and reliable to use. It can flow under pressure like silicone grease, and has high reliability under thermal cycling without solidifying.

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Product Features

Excellent thermal conductivity and low thermal resistance; Replace traditional assembled sheets with amorphous ones; Compared to prefabricated sheets, smaller shapes can be printed; Glue dispensing can be done manually or through automated processes; Glue or directly coat into various shapes; Soft, stress relieving, shock absorbing.

Typical Applications

5G base station, 5G switch; WIFI module, smart speaker, smart doorbell, smart door lock; Semiconductor blocks and heat sinks; Between the power resistor and the base; Temperature regulator and assembly surface; Thermoelectric cooling device; High performance central processing unit and graphics card processor.

Product Parameters

Product Features	Unit	Parameter	Test Standard
Extrusion Amount	g/min	35±5	90psi(30cc Syringe）
Color	— —	Grey	Vision
Specific Gravity	g/cm³	3.1±0.2	ASTM D792
Minimum UsageThickness	mm	0.1	ASTM D374
Flame Retardant Rating	— —	V-0	UL94
Operating Temperature	℃	—60~200	N/A
Thermal Conductivity @3mm,20psi	W/m·K	4.0±0.2	ASTM D5470
Thermal Resistance@0.1mm,40psi	℃in²/W	≦0.06	ASTM D5470
Breakdown Voltage@1mm	kV/mm	≧6.5	ASTM D149
Volume Resistivity@1mm	Ω·cm	≧10¹³	ASTM D257
Dielectric Constant @2mm,1MHz	C²/(N·m²)	≧6	ASTM D150
Dielectric Loss @2mm,1MHz	— —	≦0.1	ASTM D150
Shelf Life	Month	12	— —