It is a low-density, high compression ratio, and high viscosity polymer material silicone gasket, suitable for the electronic/electrical field with heat dissipation requirements. It is specifically designed to use gaps to transfer heat, fill gaps, and complete heat transfer between heating and cooling parts. At the same time, it also plays a role in insulation, shock absorption, sealing, etc. It can meet the design requirements of equipment miniaturization and ultra-thin design, with high processability and usability, and a wide range of thickness applications. It is an excellent thermal conductive filling material. It has certain flexibility, excellent insulation, compressibility, and natural surface viscosity, which can meet the requirements of automated production and convenient product maintenance.