2-HPD‑TC300DS is a low‑outgassing polymer‑based silicone thermal pad designed for electronic and electrical applications requiring thermal management. Specially developed for gap‑filling thermal transfer designs, it fills gaps to conduct heat between heat‑generating components and heat sinks, while providing insulation, shock absorption and sealing performance. It supports miniaturized and ultra‑thin device designs with excellent processability and practicality over a broad thickness range, serving as an ideal thermal interface filler. Featuring good flexibility, superior insulation, high compressibility and inherent surface tackiness, it adapts to automated production and facilitates product maintenance.