It is a high‑thermal‑conductivity polymer silicone pad, suitable for electronics and electrical sectors with heat‑dissipation requirements. Specially designed for heat transfer through gaps, it fills voids to realize thermal conduction between heat‑generating components and heat‑dissipating structures. Meanwhile, it delivers insulation, shock absorption and sealing performance. It meets the design demands for miniaturized and ultra‑thin equipment. Featuring excellent manufacturability and practicality with a wide applicable thickness range, it serves as an ideal thermal interface filling material.
With good flexibility, outstanding insulation and compressibility, plus natural surface tackiness, it supports automated production and facilitates product maintenance.